Module Packaging Engineer II
About Us:
For more than six decades, the skilled thinkers, makers, and doers at Frontgrade have embraced our mission to solve complex technology challenges across the U.S. and around the globe.
We’re the leading provider of high reliability and radiation assured solutions for defense, space, intelligence, commercial, and civil applications, and our products are designed to perform in the harshest of environments. From human spaceflight and space exploration to missile defense, electronic warfare, and healthcare tech advancements, our talented team stays in lockstep with our customers to ensure the success of their missions.
Do you want to help shape the future? In an environment where innovation and ideas go hand-in-hand? Then come join the Frontgrade Team!
Why Work For Us
We take care of our people and provide competitive health, wealth and wellbeing benefits – from day one. You’ll also discover learning and development opportunities so you can take your career to the next level – and beyond.
Other benefits include:
- Competitive Benefits: Medical (FSA + HSA), Dental, and Vision
- Immediate 401K Vesting/Matching
- Career Opportunity and Growth
- Tuition Reimbursement
- Student Loan Repayment
- Generous PTO and 11 paid Holidays per year (8 regular and 3 floating)
- 8 weeks of 100% Paid Family Leave
- Profit Sharing Plan applies to all non-Annual Incentive Plan and non-Sales Incentive Plan employees.
Responsibilities:
KEY RESPONSIBILITIES- Execute clearly defined Integrated Circuit package design assignments using ceramic, plastic, and organic materials typically leveraging existing reference designs that require significant modification
- Work with suppliers to research and report on substrates, materials, interconnects and lids based on product requirements
- Perform power and signal integrity analysis on IC package designs and apply results to improve package and product performance
- Maintain the package design library for product families
- Independently work with vendors to obtain quotes from suppliers and select preferred vendors for package materials as needed for new product development and procurement of materials
- Work with Process Engineering to establish, improve and incorporate package design guidelines for ease of assembly and/or manufacturability
- Apply basic thermal, mechanical and parasitic modeling techniques to support product performance requirements
Qualifications:
QUALIFICATIONS & EXPERIENCE- Mechanical Engineering (Bachelor's degree)
- Minimum of two (2) years of experience in designing Integrated Circuit Packaging
- CAD Software
- Microsoft Office Suite
- Engineering Deisgn Pricipals
- Material Science
- Electrical Theory
- Packaging Engineering
- Problem Solving
- Requirements Analysis
- Atention to Detail
- Product and Technical Knowledge
- Analytical Thinking
- This position requires access to technology, materials, software or hardware that is controlled by either ITAR or EAR U.S. export laws. As a condition to this job offer, in order to be employed in this position, you must be able to obtain an U.S. Government export license(s), as required by law.
- Pay Range: $93,569 - $116,961 annually. Applicable pay within the posted range may vary based on factors including, but not limited to, geographical location, job function of the position, education, and experience of the successful candidate.
Employment Transparency:
WE ARE AN EQUAL OPPORTUNITY EMPLOYER
We welcome differences and celebrate new ideas. We believe the diversity of our people inspires our creativity and drives our innovation. Everyone is welcome here, regardless of race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or genetic information.
We are committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation due to a disability for any part of the employment process, please email Careers@Frontgrade.com.
If you have relevant skills that are not reflected in your resume, we welcome your application and encourage you to share more in an optional cover letter or to join our Talent Community Connect Portal - Connect (icims.com).